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Ki P Lee

from Mission Viejo, CA
Age ~41
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Also known as:
Kipum Joy Lee, Kipum J Lee, Joy Lee, Kipum Joy Yi, Jo Y Lee
Related to:
Le M Nguyen, 56Taein Lee, 88Sulju J Lee, 65Michelle Lee, 34Sei J Lee, 50Soh Y Lee, 52Helen J Chong, 52Sulju L RJim R Kreizenbeck, 73Ha Yoon Sul, 61Andrew Lee, 33Jin H Lee, 88Ji Y Lee, 51Ban S Lee, 37Michele M Lescano, 68Chanmi P Byun, 40Sulha Ha Yoon, 61Young Lee Ji, 77Daniel Byun, 40
Connected to:
Aava Y Lee, 44Abbi Lee, 33Adama LeeAdolfo Lee, 44Ae R Lee, 31Agnes W Lee, 55Ak LeeAka Lee, 46Akkim Lee, 69Alek H Lee

Ki Lee Phones & Addresses

  • Mission Viejo, CA
  • Lucerne Valley, CA
  • Orange, CA
  • Tustin, CA
  • Westminster, CA
  • San Diego, CA
  • Anaheim, CA
  • Fremont, CA
  • Glendale, AZ
  • Tujunga, CA
  • Irvine, CA

Professional Records

Lawyers & Attorneys

Ki Lee Photo 1

Ki Jung Lee - Lawyer

Licenses:
Oregon - Active 2012
Ki Lee Photo 2

Ki Chang Lee - Lawyer

Address:
Hanol Law Offices
(600) 425-25xx (Office)
Licenses:
New York - Currently registered 1967
Education:
Brooklyn

License Records

Ki Chun Lee

License #:
2705122470 - Expired
Category:
Contractor
Issued Date:
Apr 28, 2008
Expiration Date:
Apr 30, 2016
Type:
Class C

Ki Hoon Lee

License #:
0225100686
Category:
Real Estate Individual

Medicine Doctors

Ki Lee Photo 3

Dr. Ki S Lee, Los Angeles CA - MD (Doctor of Medicine)

Specialties:
Anesthesiology
Address:
4733 W Sunset Blvd, Los Angeles, CA 90027
(323) 783-4011 (Phone)
Certifications:
Anesthesiology, 1992
Awards:
Healthgrades Honor Roll
Languages:
English
Education:
Medical School
Baylor University
Graduated: 1987
Medical School
Baylor College Of Med
Graduated: 1987
Medical School
University Ca Irvine Med Center
Graduated: 1987
Ki Lee Photo 4

Dr. Ki B Lee, Huntington Park CA - DDS (Doctor of Dental Surgery)

Specialties:
Dentistry
Address:
7208 Pacific Blvd Suite 200, Huntington Park, CA 90255
(323) 582-2200 (Phone)
Languages:
English
Ki Lee Photo 5

Dr. Ki S Lee, La Palma CA - DC (Doctor of Chiropractic)

Specialties:
Chiropractic
Address:
7951 Valley View St, La Palma, CA 90623
(714) 994-1131 (Phone)
Languages:
English
Ki Lee Photo 6

Ki H. Lee

Specialties:
Epileptologist
Work:
Florida Hospital Medical GroupFlorida Epilepsy Center
615 E Princeton St STE 540, Orlando, FL 32803
(407) 303-8127 (phone), (407) 303-8197 (fax)
Education:
Medical School
Seoul Natl Univ, Coll of Med, Chongno Ku, Seoul, So Korea
Graduated: 1990
Procedures:
Neurological Testing
Psychological and Neuropsychological Tests
Sleep and EEG Testing
Conditions:
Epilepsy
Peripheral Nerve Disorders
Languages:
English
Spanish
Description:
Dr. Lee graduated from the Seoul Natl Univ, Coll of Med, Chongno Ku, Seoul, So Korea in 1990. He works in Orlando, FL and specializes in Epileptologist. Dr. Lee is affiliated with Florida Hospital Orlando.
Ki Lee Photo 7

Ki N. Lee

Specialties:
Pain Management, Family Medicine
Work:
Ki N Lee MD
3947 Ferrara Dr, Silver Spring, MD 20906
(301) 942-9004 (phone)
Education:
Medical School
Kyungpook Natl Univ, Coll of Med, Taegu, So Korea
Graduated: 1966
Conditions:
Acute Bronchitis
Acute Sinusitis
Acute Upper Respiratory Tract Infections
Allergic Rhinitis
Anxiety Phobic Disorders
Languages:
English
Korean
Description:
Dr. Lee graduated from the Kyungpook Natl Univ, Coll of Med, Taegu, So Korea in 1966. He works in Silver Spring, MD and specializes in Pain Management and Family Medicine. Dr. Lee is affiliated with Medstar Montgomery Medical Center.
Ki Lee Photo 8

Ki Sook Lee, Los Angeles CA

Specialties:
Anesthesiology
Obstetrics & Gynecology
Therapeutic Radiology
Work:
Kaiser Permanente Los Angeles Medical Center
4867 W Sunset Blvd, Los Angeles, CA 90027
North County Ob-Gyn Medical
9850 Genesee Ave, La Jolla, CA 92037
Education:
Baylor College of Medicine (1987)
Ki Lee Photo 9

Ki Hyeong Lee

Specialties:
Neurology
Clinical Neurophysiology
Neurology with Special Qualifications in Child Neurology
Education:
Seoul National University (1990) *
Mcg Health, Inc (2002) *Neurology with Special Qualifications in Child Neurology
Medical College of Georgia (1998) *Clinical Neurophysiology
Ki Lee Photo 10

Ki Baek Lee, Huntington Park CA

Specialties:
Dentist
Address:
7208 Pacific Blvd, Huntington Park, CA 90255

Resumes

Resumes

Ki Lee Photo 11

Ki Joon Lee Centreville, VA

Work:
Hoseo Occupational Training College
Seoul, KR
May 2014 to Dec 2014
Network administrator / IT support - part time
International Digital Systems
Fort Lee, NJ
Sep 2013 to Apr 2014
IT Support
Edge Clothing Inc
Los Angeles, CA
Feb 2013 to May 2013
IT Assistant
Kenny Wholesale Electric, Inc
Los Angeles, CA
Jan 2006 to Jul 2008
Technical support / Shipping Assistant Manager
Navy Computer and Telecommunications Station - Republic of Korea, Navy

Jul 1998 to Nov 2000
IT Support
Education:
Hoseo Technical college
Jun 2014 to Dec 2014
Certificate of Network in security operations
California State University
May 2012
Bachelor of Science in Information System
Yuhan College
Seoul, KR
Jan 2004
Computer Science & Engineering

Business Records

Name / Title
Company / Classification
Phones & Addresses
Ki Lee
Owner
Lees Auto Service
General Auto Repair
1301 Avalnati, Long Beach, CA 90813
(562) 432-0900
Ki Dong Lee
President
The Bethel Promotion Co., Inc
20505 Vly Blvd, Walnut, CA 91789
Ki Jin Lee
President
Heba Nature, Inc
Nonclassifiable Establishments
928 S Western Ave, Los Angeles, CA 90006
949 S Kingsley Dr, Los Angeles, CA 90006
Ki Soo Lee
President
Cj Bakery, Inc
3470 Wilshire Blvd, Los Angeles, CA 90010
Ki Ha Lee
President
Spl Electronics Inc
Import/Export Wholesale
14747 Artesia Blvd, La Mirada, CA 90638
(714) 690-0270
Ki Ho Lee
President
Jesus' Love Community Church
410 W Saint Andrews Ave, La Habra, CA 90631
4821 Daroca Way, Buena Park, CA 90621
Ki Seon Lee
President
G & C Global, Inc
Whol Women's/Child's Clothing
3142 Pacific Coast Hwy, Torrance, CA 90505
3110 Pacific Coast Hwy, Torrance, CA 90505
Ki Young Lee
President
Shine Dental Corporation
5101 Florence Ave, Bell, CA 90201
889 Crenshaw Blvd, Los Angeles, CA 90005
PO Box 290007, Phelan, CA 92329

Publications

Isbn (Books And Publications)

Present and Future Security Problems of Korea: Csis Statesmen's Forum Address May 8, 1987

Author

Ki Baek Lee

ISBN #

0892061081

Us Patents

Application Of Conductive Via Or Trench For Intra Module Emi Shielding

US Patent:
20220310530, Sep 29, 2022
Filed:
Mar 22, 2022
Appl. No.:
17/655801
Inventors:
- Irvine CA, US
Hoang Mong Nguyen - Fountain Valley CA, US
Matthew Sean Read - Foothill Ranch CA, US
Howard E. Chen - Anaheim CA, US
Ki Wook Lee - Irvine CA, US
Yi Liu - San Diego CA, US
International Classification:
H01L 23/552
H01L 23/31
H01L 25/065
H01L 23/498
H01L 21/56
H01L 21/48
H01L 25/00
Abstract:
A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

Electronic Package And Method For Manufacturing An Electronic Package

US Patent:
20230115846, Apr 13, 2023
Filed:
Oct 19, 2021
Appl. No.:
17/504911
Inventors:
- Irvine CA, US
Anthony James LoBianco - Irvine CA, US
Howard E. Chen - Anaheim CA, US
Ki Wook Lee - Irvine CA, US
Yi Liu - San Diego CA, US
International Classification:
H01L 23/498
H01L 21/56
H01L 21/48
H01L 23/31
H01L 25/10
H01L 25/00
Abstract:
An electronic package is provided. The electronic package comprises a substrate having a first side and a second side, the substrate configured to receive one or more electronic components; a first electronic component mounted to the first side of the substrate; a first mold structure extending over at least part of the first side of the substrate; a group of through-mold connections provided on the first side of the substrate, the through-mold connections substantially formed of non-reflowable electrically conductive material; the first mold structure substantially encapsulating the group of through-mold connections; the group of through-mold connections exposed through the first mold structure. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.

Radio-Frequency Module With Integrated Conformal Shield Antenna

US Patent:
20210399423, Dec 23, 2021
Filed:
Jul 12, 2021
Appl. No.:
17/305647
Inventors:
- Irvine CA, US
Robert Francis Darveaux - Corona Del Mar CA, US
Anthony James LoBianco - Irvine CA, US
Lori Ann DeOrio - Irvine CA, US
Hoang Mong Nguyen - , US
Ki Wook Lee - Irvine CA, US
Hardik Bhupendra Modi - Irvine CA, US
Foad Arfaei Malekzadeh - Irvine CA, US
Stephen Joseph Kovacic - Newport Beach CA, US
René Rodriguez - Rancho Santa Margarita CA, US
International Classification:
H01Q 9/04
B29C 41/42
H01Q 5/35
H01Q 9/06
Abstract:
An antenna structure can include a printed circuit board module and a mold compound disposed on a side of the printed circuit board module. A planar antenna is defined by a conformal shield layer disposed on a first surface of the mold compound such that the mold compound is disposed between the printed circuit board module and the conformal shield layer. The thickness of the mold compound layer and the shape of the conformal shield layer can be varied to optimize a performance of the antenna.

Method Of Making A Closed Cavity Printed Circuit Board With Patterned Laminate Structure

US Patent:
20210315109, Oct 7, 2021
Filed:
Apr 14, 2021
Appl. No.:
17/230367
Inventors:
- Irvine CA, US
Ki Wook Lee - Irvine CA, US
International Classification:
H05K 3/46
H01Q 1/38
H05K 1/16
Abstract:
A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

Method Of Making Printed Circuit Board Structure Including A Closed Cavity With Vias

US Patent:
20210315110, Oct 7, 2021
Filed:
Apr 14, 2021
Appl. No.:
17/230584
Inventors:
- Irvine CA, US
Ki Wook Lee - Irvine CA, US
International Classification:
H05K 3/46
H01Q 1/38
H05K 1/16
Abstract:
A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

Printed Circuit Board Structure Including A Closed Cavity

US Patent:
20200395659, Dec 17, 2020
Filed:
May 26, 2020
Appl. No.:
16/883631
Inventors:
- Woburn MA, US
Ki Wook Lee - Irvine CA, US
International Classification:
H01Q 1/38
H05K 3/46
H05K 3/42
H05K 1/11
H05K 1/02
H01Q 9/04
H01Q 1/24
H01Q 1/22
H01Q 1/36
Abstract:
A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.

Devices And Methods Related To Nested Filters

US Patent:
20200077510, Mar 5, 2020
Filed:
Aug 31, 2019
Appl. No.:
16/558056
Inventors:
- Woburn MA, US
Ki Wook LEE - Irvine CA, US
Takeshi FURUSAWA - Toyonaka-Shi, JP
Sundeep Nand NANGALIA - Raleigh NC, US
Russ Alan REISNER - Oxnard CA, US
John C. BALDWIN - Simi Valley CA, US
International Classification:
H05K 1/02
H05K 1/18
H05K 1/11
H01Q 1/22
H04B 1/10
Abstract:
Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

Printed Circuit Board Structure Including A Closed Cavity

US Patent:
20180323502, Nov 8, 2018
Filed:
May 1, 2018
Appl. No.:
15/967976
Inventors:
- Woburn MA, US
Ki Wook Lee - Irvine CA, US
International Classification:
H01Q 1/38
H05K 3/46
H05K 3/42
H05K 1/11
H05K 1/02
H01Q 9/04
H01Q 1/24
Abstract:
A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.
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Ki P Lee from Mission Viejo, CA, age ~41 Get Report