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Jack Galyean Phones & Addresses

  • Hiawatha, IA
  • Cedar Rapids, IA
  • 4533 Waterfront Farms Dr, Draper, VA 24324
  • Galax, VA
  • Marion, IA
  • Bel Air, MD
  • Plano, TX

Resumes

Resumes

Jack Galyean Photo 1

Logistics And Driver Manager

Location:
4533 Waterfront Farms Dr, Draper, VA 24324
Industry:
Electrical/Electronic Manufacturing
Work:
Abilene Motor Express
Logistics and Driver Manager

Pcsm 1994 - 2004
President and General Manager
Education:
North Carolina State University 1976 - 1979
Bachelor of Applied Science, Bachelors, Bachelor of Science
Skills:
Management
Project Management
Cross Functional Team Leadership
Microsoft Office
Customer Service
Jack Galyean Photo 2

Principal Program Manager, Government

Location:
Cedar Rapids, IA
Industry:
Program Development
Work:
Rockwell Collins since Mar 2007
Principal Program Manager, Government Systems
Education:
North Carolina State University 1977 - 1979
B.S., Industrial Arts / Technology

Publications

Us Patents

High-Frequency Drum-Style Slip-Ring Modules

US Patent:
7559767, Jul 14, 2009
Filed:
May 15, 2007
Appl. No.:
11/803483
Inventors:
Donnie S. Coleman - Dublin VA, US
Jack T. Galyean - Cedar Rapids IA, US
Assignee:
Moog Inc. - East Aurora NY
International Classification:
H01R 39/00
US Classification:
439 13, 439 23, 439 24, 439 25
Abstract:
A drum-style slip-ring module () is used in a contact-type communication system. The module utilizes PCB construction to construct a plurality of stacked electrically-conductive rings () and a plurality of dielectric layers () electrically isolating the conductive rings. Each of the dielectric layers includes a centrally-located aperture (). The module also includes a cylindrical ground plane () positioned in the centrally-located aperture. The module is configured to provide electrical connection to each of the rings at an exterior surface of the module. Each group of feed line vias can be designed as impedance-controlled transmission lines with connections to each ring group. The construction described in this invention can create slip-ring transmission line structures with bandwidth from DC to 5 GHz or higher, allowing the slip-ring to be used to transfer multi-gigabit digital data streams.

Electrical Slip Ring Platter Multilayer Printed Circuit Board And Method For Making Same

US Patent:
20030135981, Jul 24, 2003
Filed:
Jan 22, 2003
Appl. No.:
10/348788
Inventors:
Jack Galyean - Galax VA, US
International Classification:
H02K015/00
US Classification:
029/597000, 029/732000, 029/596000, 310/232000
Abstract:
A slip ring and a method for manufacturing a slip ring utilizes a first double clad copper laminate with a first side and a second side separated by a first dielectric and a second double clad copper laminate with a third side and a fourth side separated by a second dielectric. Copper is selectively removed from the second and third sides to provide desired patterns in the copper. The second and third sides are joined in a desired orientation. Substantially, all of the copper from a window in the first and fourth sides is removed to expose the first and second dielectrics. A plurality of concentric grooves is machined into the first and second dielectrics from the first and fourth sides and the concentric grooves are metalized to provide a plurality of concentric metalized rings.
Jack Thomas Galyean from Hiawatha, IA, age ~71 Get Report