Inventors:
Graham J. Siddall - Woodside CA
Assignee:
Varian Associates, Inc. - Palo Alto CA
International Classification:
H01L 4108
Abstract:
A deformable vacuum pin chuck includes a thin silicon chuck for supporting a semiconductor wafer during lithographic processing and a number of piezoelectric transducers for selectively deforming the chuck. Chuck deformation caused by application of electric potentials to selected transducers may be used to correct flatness deviations in the wafer and, thereby, a desired degree of flatness of the semiconductor wafer may be obtained.