Inventors:
Geza Bujtas - Holmdel NJ
Robert A. Hupp - Manville NJ
Assignee:
Smiths Industries Aerospace and Defense Systems, Inc. - Grand Rapids MI
International Classification:
H05K 720
Abstract:
The invention centers around a circuit board assembly having a heat sink with a buss bar integrally formed therein. The heat sink is provided between two parallel, opposed circuit boards. The buss bar is provided between the two circuit boards and is in electrical contact with circuit modules provided on both circuit boards. The buss bar is electrically insulated from both the circuit boards and the heat sink but electrically connected to the circuit modules.