Dennis R Pyper

8310835, Nov 13, 2012

Apr 28, 2010

12/769086

Gloria Lin - San Francisco CA, US
Bryson Gardner, Jr. - San Francisco CA, US
Joseph Fisher, Jr. - San Jose CA, US
Dennis Pyper - San Jose CA, US
Amir Salehi - San Jose CA, US

Apple Inc. - Cupertino CA

H05K 7/02
H01R 43/00

361760, 361790, 361795, 361803, 257723, 257724, 257668, 257686, 257698, 174260, 174263, 174266, 29830, 29831, 29832, 29852

This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive and/or active elements of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.

8334704, Dec 18, 2012

Sep 23, 2009

12/565085

Gloria Lin - San Ramon CA, US
Bryson Gardner, Jr. - San Francisco CA, US
Joseph Fisher, Jr. - San Jose CA, US
Dave Goh - Los Altos CA, US
Barry Corlett - Brisbane CA, US
Dennis Pyper - San Jose CA, US
Amir Salehi - San Jose CA, US

Apple Inc. - Cupertino CA

G01R 31/20

32475408, 3247503, 361749, 438 15

This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e. g. , a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in “bare die” form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board (“flex”). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.

20100226101, Sep 9, 2010

Mar 9, 2009

12/400692

Kyle H. Yeates - Palo Alto CA, US
James Bilanski - Palo Alto CA, US
Dennis Pyper - San Jose CA, US

H05K 7/00
H05K 3/02

361748, 29846

Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assembling two or more separate substrates into a multi-part substrate. By use of multi-part substrate arrangements according to the invention, portable electronic devices are able to be thinner and more compact.

20100246143, Sep 30, 2010

Mar 26, 2009

12/412263

Richard Hung Minh Dinh - Cupertino CA, US
Andrew Just - San Francisco CA, US
Dennis Pyper - San Jose CA, US
Hugo Fiennes - Palo Alto CA, US
Scott Myers - San Francisco CA, US
Erik Wang - Redwood City CA, US
Ron Dimpflmaier - Los Gatos CA, US

H05K 7/00
H05K 9/00
H05K 13/04

361748, 361818, 29729

Improved approaches for providing electromagnetic interference shielding to one or more electrical components within a housing of a portable electronic device are disclosed. According to one aspect of certain embodiments, an electromagnetic shield can be attached to one or more edges of a substrate (e.g., printed circuit board) provided within a housing of a portable electronic device. Advantageously, this allows the substrate space to be efficiently utilized such that relatively wide electrical components can be provided on the substrate without having to further increase the width of the substrate to provide space for an EMI shielding structure and its attachment to the substrate. The housing of the portable electronic device can be compact, such as a low profile housing.

20110255250, Oct 20, 2011

Jun 4, 2010

12/794599

Richard Hung Minh Dinh - San Jose CA, US
Tang Yew Tan - Palo Alto CA, US
Nicholaus Ian Lubinski - San Francisco CA, US
Jason Sloey - San Jose CA, US
Shayan Malek - San Jose CA, US
Scott Myers - San Francisco CA, US
Wyeman Chen - Hayward CA, US
Dennis R. Pyper - San Jose CA, US
Douglas P. Kidd - San Jose CA, US
Joshua G. Wurzel - Sunnyvale CA, US
David A. Pakula - San Francisco CA, US

H05K 1/14
F16B 37/00
F16B 39/02
H05K 1/00
H05K 1/11

361749, 361803, 174250, 174257, 411 82, 411427

Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.

20110255850, Oct 20, 2011

Jun 4, 2010

12/794601

Richard Hung Minh Dinh - San Jose CA, US
Tang Yew Tan - Palo Alto CA, US
Jason Sloey - San Jose CA, US
Shayan Malek - San Jose CA, US
Scott Myers - San Francisco CA, US
Dennis R. Pyper - San Jose CA, US
Douglas P. Kidd - San Jose CA, US
Ronald W. Dimpflmaier - Los Gatos CA, US
Andrew B. Just - San Francisco CA, US
Trent Weber - Saratoga CA, US
Daniel W. Jarvis - Sunnyvale CA, US

G03B 15/03
H01R 13/648
H05K 9/00
H01R 13/516

396176, 174 50, 439108, 361818

Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.

20120075817, Mar 29, 2012

Dec 6, 2011

13/312989

Kyle H. Yeates - Palo Alto CA, US
James Bilanski - Palo Alto CA, US
Dennis Pyper - San Jose CA, US

H05K 7/02

361760

Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assembling two or more separate substrates into a multi-part substrate. By use of multi-part substrate arrangements according to the invention, portable electronic devices are able to be thinner and more compact.

20120140423, Jun 7, 2012

Dec 1, 2010

12/958293

Joseph Fisher, JR. - San Jose CA, US
Sean Mayo - Mountain View CA, US
Dennis R. Pyper - San Jose CA, US
Paul Nangeroni - Mountain View CA, US
Jose Mantovani - Los Altos CA, US

H05K 7/00

361748

Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.