US Patent:
20120181537, Jul 19, 2012
Inventors:
Wei Cao - San Jose CA, US
Cheng T. Horng - San Jose CA, US
Witold Kula - Sunnyvale CA, US
Chyu Jiuh Torng - Pleasanton CA, US
International Classification:
H01L 29/82
H01L 21/36
H01L 29/04
US Classification:
257 53, 438 3, 257421, 257E29003, 257E29323, 257E21461
Abstract:
A MTJ in an MRAM array is disclosed with a composite free layer having a lower crystalline layer contacting a tunnel barrier and an upper amorphous NiFeX layer for improved bit switching performance. The crystalline layer is Fe, Ni, or FeB with a thickness of at least 6 Angstroms which affords a high magnetoresistive ratio. The X element in the NiFeX layer is Mg, Hf, Zr, Nb, or Ta with a content of 5 to 30 atomic %. NiFeX thickness is preferably between 20 to 40 Angstroms to substantially reduce bit line switching current and number of shorted bits. In an alternative embodiment, the crystalline layer may be a Fe/NiFe bilayer. Optionally, the amorphous layer may have a NiFeM/NiFeMconfiguration where Mand Mare Mg, Hf, Zr, Nb, or Ta, and M1 is unequal to M2. Annealing at 300 C. to 360 C. provides a high magnetoresistive ratio of about 150%.