Charles J Donaher

39514951, Apr 20, 1976

Sep 23, 1974

5/508464

Charles Joseph Donaher - Los Altos Hills CA
James C. K. Lee - Santa Clara CA

Advanced Memory Systems, Inc. - Sunnyvale CA

H05K 502

339 17CF

A leadless package receptacle for packaging and mounting electronic devices. The receptacle retains a plurality of spring contacts for soldering to a printed circuit board in a conventional manner and disposed within the receptacle to yieldably engage the lower surface of the package. The chip carrier has a plurality of conductive areas on the lower surface thereof for engaging the spring contacts and further has edge regions cooperatively disposed with respect to locking members on the receptacle for retaining the package in the receptacle. A mounting and removal tool is also disclosed.

43125557, Jan 26, 1982

Oct 17, 1979

6/085767

Charles J. Donaher - Los Altos Hills CA
Gordon D. Christensen - San Jose CA

Thomas & Betts Corporation - Raritan NJ

H01R 1354

339 75MP

A receptacle for stacked support of electronic packages provides ready address/selection of each package by disposing vertically spaced receptacle contact sets in offset relation longitudinally of an elongate package-receiving channel. Package stacking is facilitated by a fixed support for a lower package and a further support selectively movable into the package-receiving channel for supporting an upper package. Zero insertion force is provided by an actuator operable to displace receptacle contact sets from noninterfering disposition with respect to the channel into engagement with package contacts.

43565328, Oct 26, 1982

Jul 18, 1980

6/170014

Charles J. Donaher - Los Altos Hills CA
Gordon D. Christensen - San Jose CA

Thomas & Betts Corporation - Raritan NJ

H05K 710

361393

Common printed circuit board area usage is provided for electronic packages and accessory components by the provision of an assembly including a receptacle stacking a package and accessory component and having electrical contact elements with fixed portions selectively connected to component contacts and other portions for engaging package contacts. In a preferred embodiment, the assembly includes one or more dual-in-line packages (DIP) and the accessory component is a capacitive decoupling assembly.

40451054, Aug 30, 1977

Mar 17, 1975

5/559215

James C. K. Lee - Los Altos Hills CA
Charles Joseph Donaher - Los Altos Hills CA

Advanced Memory Systems, Inc. - Sunnyvale CA

H05K 112
H05K 708

339 17CF

A leadless package receptacle for mounting and interconnecting to electronic devices (e. g. leadless package) which can be interconnected with a second receptacle for packaging such devices, said receptacles having improved spring contact members. The receptacle incorporates a plurality of uniquely designed spring contacts for connection to a printed circuit board or other circuit member in a conventional manner. The spring contacts are arranged and configured within the receptacle to yieldably engage the lower surface of the leadless package so as to maintain a line contact. In addition, each spring member has a separate arm member to engage the spring contact members of the second package. The leadless package includes a chip carrier which has a plurality of conductive areas on the lower surface thereof for engaging the spring contacts. Edge regions are cooperatively disposed on the carrier with respect to locking members on the receptacle for retaining the package in the receptacle.

RE319295, Jun 25, 1985

May 27, 1983

6/499095

Charles J. Donaher - Los Altos Hills CA
Gordon D. Christensen - San Jose CA

Thomas & Betts Corporation - Raritan NJ

H05K 720

361393

Common printed circuit board area usage is provided for electronic packages and accessory components by the provision of an assembly including a receptacle stacking a package and accessory component and having electrical contact elements with fixed portions selectively connected to component contacts and other portions for engaging package contacts. In a preferred embodiment, the assembly includes one or more dual-in-line packages (DIP) and the accessory component is a capacitive decoupling assembly.

44227035, Dec 27, 1983

Sep 15, 1981

6/302445

Gordon D. Christensen - San Jose CA
Charles J. Donaher - Los Altos Hills CA

Thomas & Betts Corporation - Raritan NJ

H01R 13629

339 74R

A connector for zero or low insertion force receipt of multi-pin arrays, such as those in very large scale integration (VLSI) components, includes cam surfaces for selective movement to oppose the self-biasing forces of connector contacts for pin insertion and reverse movement to permit the contacts to effect tight engagement with the pins under the influence of such self-biasing forces.

44962053, Jan 29, 1985

Jul 23, 1982

6/401369

Gordon D. Christensen - San Jose CA
Charles J. Donaher - Los Altos Hills CA

Thomas & Betts Corporation - Raritan NJ

H01R 13629

339 74R

A connector for low or zero insertion force receipt of multi-pin arrays, such as those in very large scale integration (VLSI) components, includes cooperating camming surfaces having inclined ramps and slots. Selective longitudinal movement of a cam actuator causes vertical movement of a cam plate whereby self-biasing of connector contacts is opposed for ready pin insertion. Engagement between the cam plate and contacts ceases upon reverse movement of the cam actuator to permit the contacts to effect tight engagement with the pins under the influence of their such self-biasing forces.