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Martin B Tran

from Santa Clara, CA
Age ~48
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Also known as:
Ba Tran Martin, Tin B Tran
Phone and address:
2087 Sahara Way APT 7, Santa Clara, CA 95050
(408) 246-5605
Related to:
Khuong Thi Tran, 75Charlie C Tran, 67Carolyn Nguyen, 59Hieu N NguyenDuc M Bui, 49Tai N Dinh, 53Jane Tran, 57
Connected to:
Ada Tran, 54Addison Tran, 29Aivi T Tran, 41Alaska Tran, 35Anh Tran, 42Antares M Tran, 53Augustin U Tran, 28Ayen L TranBay Tran, 78Bernice L Tran, 37

Martin Tran Phones & Addresses

  • 2087 Sahara Way APT 7, Santa Clara, CA 95050 (408) 246-5605

Professional Records

Medicine Doctors

Martin Tran Photo 1

Martin Q. Tran

Specialties:
Nephrology
Work:
East Tennessee Medical AssocsEast Tennessee Medical Associates
107 Woodlawn Dr STE 1, Johnson City, TN 37604
(423) 929-7158 (phone), (423) 928-9625 (fax)

Fresenius Kidney Care Johnson City
100 Technology Ln, Johnson City, TN 37604
(423) 929-7181 (phone), (423) 929-2548 (fax)

Fresenius Medical Care Of Eastern Tennessee
180 Serral Dr, Greeneville, TN 37745
(423) 638-1201 (phone), (423) 638-9397 (fax)

Davita Tennessee Smokie Mountain Dialysis
101 Med Tech Pkwy STE 406, Johnson City, TN 37604
(423) 232-8882 (phone), (423) 232-8883 (fax)
Education:
Medical School
A.T. Still University of Health Sciences/ Kirksville College of Osteopathic Medicine
Graduated: 1997
Procedures:
Dialysis Procedures
Electrocardiogram (EKG or ECG)
Vaccine Administration
Conditions:
Acute Renal Failure
Acute Sinusitis
Acute Upper Respiratory Tract Infections
Anemia
Atherosclerosis
Languages:
English
Description:
Dr. Tran graduated from the A.T. Still University of Health Sciences/ Kirksville College of Osteopathic Medicine in 1997. He works in Johnson City, TN and 3 other locations and specializes in Nephrology. Dr. Tran is affiliated with Franklin Woods Community Hospital, James H Quillen VA Medical Center, Johnson City Medical Center, Laughlin Memorial Hospital and Sycamore Shoals Hospital.

Resumes

Resumes

Martin Tran Photo 2

Senior Process Engineer

Location:
Santa Clara, CA
Industry:
Nanotechnology
Work:
Applied Materials since Sep 2007
Process Engineer
Applied Materials 1999 - 2007
Process Technician
Synergy Semiconductor, now Micrel Semiconductor Apr 1996 - Jul 1998
Process Technician
Toshiba Semiconductor 1995 - Apr 1996
Operator
Rohm Electronics 1994 - 1995
Operator
Education:
California State University-East Bay 2009 - 2010
BS, Business Admin, Concentration in Marketing Management and Entrepreneurship
Martin Tran Photo 3

Martin Tran

Martin Tran Photo 4

Martin Tran

Position:
Engineer at Ntiva, Inc.
Location:
Rockville, Maryland
Industry:
Information Technology and Services
Work:
Ntiva, Inc. since Dec 2010
Engineer
CWPS Nov 2008 - Aug 2009
ASE
Intelsat Sep 2006 - Nov 2007
IT Analyst
USPTO Sep 2004 - Sep 2005
PTO
Education:
University of Maryland College Park 1999 - 2003
B.S., Engineering

Publications

Us Patents

Rapid Cooling Of A Substrate By Motion

US Patent:
20100193154, Aug 5, 2010
Filed:
Jan 27, 2010
Appl. No.:
12/694634
Inventors:
WOLFGANG R. ADERHOLD - Cupertino CA, US
LEONID M. TERTITSKI - Los Gatos CA, US
AARON MUIR HUNTER - Santa Cruz CA, US
MARTIN TRAN - Santa Clara CA, US
Assignee:
APPLIED MATERIALS, INC. - Santa Clara CA
International Classification:
F28D 21/00
US Classification:
165 61
Abstract:
Methods for cooling a substrate are provided herein. In some embodiments, a method for cooling a substrate includes heating a substrate in a process chamber from an introductory temperature to a peak temperature of greater than about 900 degrees Celsius; and cooling the substrate from within about 50 degrees Celsius of the peak temperature by moving the substrate at a rate of at least about 3 millimeters/second in a direction normal to an upper surface of the substrate. In some embodiments, cooling the substrate by moving the substrate further comprises moving the substrate to a first position having a first distance from an upper surface of the process chamber; and subsequently moving the substrate to a second position having a second distance that is further away from the upper surface than the first distance. In some embodiments, a residence time proximate the peak temperature is about 0.6 seconds or less.

Support Cylinder For Thermal Processing Cylinder

US Patent:
20170263493, Sep 14, 2017
Filed:
May 19, 2017
Appl. No.:
15/600336
Inventors:
- Santa Clara CA, US
Aaron Muir HUNTER - Santa Cruz CA, US
Joseph M. RANISH - San Jose CA, US
Norman TAM - Cupertino CA, US
Jeffrey TOBIN - Mountain View CA, US
Jiping LI - Palo Alto CA, US
Martin TRAN - Santa Clara CA, US
International Classification:
H01L 21/687
H01L 21/67
H01L 21/324
Abstract:
Embodiments of the disclosure generally relate to a support cylinder used in a thermal process chamber. In one embodiment, the support cylinder includes a hollow cylindrical body comprising an inner peripheral surface, an outer peripheral surface parallel to the inner peripheral surface, wherein the inner peripheral surface and the outer peripheral surface extend along a direction parallel to a longitudinal axis of the support cylinder, and a lateral portion extending radially from the outer peripheral surface to the inner peripheral surface, wherein the lateral portion comprises a first end having a first beveled portion, a first rounded portion, and a first planar portion connecting the first beveled portion and the first rounded portion, and a second end opposing the first end, the second end having a second beveled portion, a second rounded portion, and a second planar portion connecting the second beveled portion and the second rounded portion.

Support Cylinder For Thermal Processing Chamber

US Patent:
20160300752, Oct 13, 2016
Filed:
Jun 21, 2016
Appl. No.:
15/188706
Inventors:
- Santa Clara CA, US
Aaron Muir HUNTER - Santa Cruz CA, US
Joseph M. RANISH - San Jose CA, US
Norman TAM - Cupertino CA, US
Jeffrey TOBIN - Mountain View CA, US
Jiping LI - Palo Alto CA, US
Martin TRAN - Santa Clara CA, US
International Classification:
H01L 21/687
H01L 21/324
H01L 21/67
Abstract:
Embodiments of the disclosure generally relate to a support cylinder used in a thermal process chamber. In one embodiment, the support cylinder includes a hollow cylindrical body comprising an inner peripheral surface, an outer peripheral surface parallel to the inner peripheral surface, wherein the inner peripheral surface and the outer peripheral surface extend along a direction parallel to a longitudinal axis of the support cylinder, and a lateral portion extending radially from the outer peripheral surface to the inner peripheral surface, wherein the lateral portion comprises a first end having a first beveled portion, a first rounded portion, and a first planar portion connecting the first beveled portion and the first rounded portion, and a second end opposing the first end, the second end having a second beveled portion, a second rounded portion, and a second planar portion connecting the second beveled portion and the second rounded portion.

Support Cylinder For Thermal Processing Chamber

US Patent:
20150050819, Feb 19, 2015
Filed:
Jun 6, 2014
Appl. No.:
14/298389
Inventors:
- Santa Clara CA, US
Aaron Muir HUNTER - Santa Cruz CA, US
Joseph M. RANISH - San Jose CA, US
Norman TAM - Cupertino CA, US
Jeffrey TOBIN - Mountain View CA, US
Jiping LI - Palo Alto CA, US
Martin TRAN - Santa Clara CA, US
International Classification:
H01L 21/683
F16C 13/00
H01L 21/324
B05D 7/22
US Classification:
438795, 427230, 492 59
Abstract:
Embodiments of the disclosure generally relate to a support cylinder used in a thermal process chamber. In one embodiment, the support cylinder comprises a ring body having an inner peripheral surface and an outer peripheral surface, wherein the ring body comprises an opaque quartz glass material and wherein the ring body is coated with an optical transparent layer. The optical transparent layer has a coefficient of thermal expansion that is substantially matched or similar to the opaque quartz glass material to reduce thermal expansion mismatch that may cause thermal stress under high thermal loads. In one example, the opaque quartz glass material is synthetic black quartz and the optical transparent layer comprises a clear fused quartz material.
Control profile
Martin B Tran from Santa Clara, CA, age ~48 Get Report